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LDI for Substrate - APEX

APEX Series of LDI is specifically designed and developed for IC Substrate manufacturing. It has the minimum line width of 10um, meet the challenge of high resolution and accurate alignment for Flip-chip application.

  • Local alignment for flexible segmentation
  • Modes of fixed scaling and flexible local-scaling
  • Scaling SPC
  • Substrate distortion compensation
  • Stamp and Coding capability
  • Fully Automation line compatible

APEX Specification

 #

Item

APEX 280

1

Throughput

35mj 

45s/side

2

50mj 

45s/side

3

80mj 

45s/side

4

Data Resolution

1.0um( 25400dpi)

5

Min. Line Width

10um 

6

Alignment Accuracy

5um 

7

Inner Layer Alignment

10um 

8

Light Source

5*10W 

9

Wavelength

405nm

10

Panel Max Dim

530*660mm

11

Tolerance

10%

12

Remark

Adapt to PBGA/CSP/EBGA/Flip-chip

 

Solder Mask LDI Galaxy 100

Advantools Galaxy 100 excellent solder mask performance can improve scaling management and increase yield , bringing advantage of low cost and production imporvement

  • Solder mask
  • Local alignment for flexible segmentation
  • Modes of fixed scaling and flexible local -scaling
  • Scaling SPC
  • Substrate distortion compensation
  • Stamp and Coding capability
  • Fully Automation line compatible

Galaxy 100 Specification

 #

Item

Galaxy 100

Galaxy 100 HS

1

Throughput

250mj(benchmark)

33s/side

33s/PCS

4

Data Resolution

3.0um 

3.0um 

6

Alignment Accuracy

12um 

12um 

7

Inner Layer Alignment

24um 

24um 

8

Light Source

2*20W 

2*20W 

 

printing ink Type

   
 

Under Cut

   

9

Wavelength

405nm

405nm

10

Panel Max Dim

600*800mm 

600*800mm 

11

Tolerance

10%

10%

12

Remark

Galaxy 100 HS indicate Galaxy 100 Aotumation line